
Our recent publication in IEEE Antennas and Propagation Magazine (APM) introduces the history and latest progress in antenna packaging technology, with a focus on multilayer solutions. This work is a collaboration with Prof. Wonbin Hong’s group at POSTECH.
We investigate design methodologies and features from different perspectives, including material type (organic or inorganic) and application (base station or user mobile terminal). We also review the historical development of multilayer antenna packaging and discuss the integration of antenna arrays and radio-frequency ICs (RFICs), which are silicon-based phased array systems.
Citation:
S. Y. Lee, D. Lee, Y. Zhang, W. Hong, and N. Ghalichechian, “History and the Latest Progress in Antenna Packaging Technology: Part 1: Multilayer Solutions,” IEEE Antennas and Propagation Magazine, vol. 67, no. 3, pp. 48–61, June 2025, doi: 10.1109/MAP.2025.3560852.